SAAP CASE v1f glue-only — LARGE
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DESIGN
  Glue-only shell (no M5 bosses, holes, or nut pockets).
  Outer ~ 410.7 × 352.4 × 36.0 mm
  Folded saap nest ~ 353.1 × 291.8 × 20.0 mm, ~1.0 mm clearance
  Seam glue gap: 0.18 mm (dovetails + floor/deck tongue-and-groove)
  Lid seams: real dovetails + wide T&G laps (not the old 0.8 mm lands)
  Printed hinge pins + latch retained; minimal nest (no tassel bays)
  Layout: 2×3 tiles → 6 plates (2 tiles/plate)
  Gold gap OK (≥2 mm): True (min gap 126.3 mm)

PRINT SETTINGS (Bambu P2S)
  Filament: PETG Matte Black (body) + PETG Basic Gold (rim/logo)
  Plate: Smooth PEI / High Temp Plate
  Nozzle/bed: 240 °C / 70 °C
  No ironing; prime tower OFF
  0.4 mm nozzle, ~12% infill, 2 walls (as in 3MF)

SLICED WEIGHT / TIME (Bambu Studio CLI)
  TOTAL ~ 505.3 g, 15.54 h
  - SAAP_CASE_LARGE_v1f_plate1_base_00_01_Black: 109.51 g, 3h 9m 22s
  - SAAP_CASE_LARGE_v1f_plate2_base_02_10_Black: 124.46 g, 3h 35m 7s
  - SAAP_CASE_LARGE_v1f_plate3_base_11_12_Black: 109.90 g, 3h 3m 38s
  - SAAP_CASE_LARGE_v1f_plate4_lid_00_01_Black_Gold: 54.70 g, 1h 47m 55s
  - SAAP_CASE_LARGE_v1f_plate5_lid_02_10_Black_Gold: 52.71 g, 1h 57m 16s
  - SAAP_CASE_LARGE_v1f_plate6_lid_11_12_Black_Gold: 54.03 g, 1h 59m 21s

3MF FOLDER
  /workspace/saap_case/v1f_glue_large/3mf/

GLUE ASSEMBLY
  Adhesive:
    Preferred: 2-part epoxy (5–30 min set) OR medium/gel CA (cyanoacrylate).
    Avoid thin watery CA alone on large seams — it runs before wetting the
    full dovetail/T&G. Gel CA or epoxy fills the 0.15–0.2 mm glue gap.
    Optional: CA activator on one face for gel CA; mix epoxy thoroughly.

  Dry-fit FIRST:
    1. Dry-assemble all 6 base tiles (00–12) — dovetails should seat with a
       light friction / slight play from the glue gap. Confirm outer outline.
    2. Dry-assemble all 6 lid tiles + check gold rim/logo pieces seat cleanly
       (gold never touches gold — ≥2 mm gap is designed in).
    3. Dry-fit base∪lid closed; confirm latch and hinge pin alignment.
    4. Number tiles with tape matching plate labels before gluing.

  Glue order:
    A. BASE shell
       - Glue wall dovetails + floor T&G of one seam at a time (work
         row-wise: 00–01, then 02–10, then 11–12; then join the three pairs).
       - Wipe squeeze-out from the nest pocket immediately — cured epoxy
         in the nest ruins the ~1 mm clearance.
       - Clamp flat on a true surface (glass/PEI sheet) with even pressure
         across seams. Protect finish with painter's tape / parchment.
       - Cure per adhesive (gel CA: minutes; epoxy: follow pot life, often
         fixture 30–60 min, full strength overnight).
    B. LID shell
       - Same order for black lid tiles; glue dovetails + wide T&G laps.
       - Keep the lid TOP face clean — no glue on the gold border / logo
         seating faces. Glue gold accents after the black lid is cured,
         or print them multi-color in-place (AMS) so no gold glue step.
       - Clamp lid flat; protect gold faces.
    C. HARDWARE
       - Insert printed hinge pins through base/lid hinge knuckles.
       - Install latch; verify open/close and that nested saap clears lid.

  Clamp & cure tips:
    - Light clamp pressure — crush will close the designed glue gap and
      starve the joint. Aim for even bead along the dovetail.
    - Support full span; do not cantilever half the shell while curing.
    - For stage transport strength: let epoxy reach full cure (≥24 h) before
      loading the lid with the saap in a bag/vehicle.

CHECKS (CAD)
  saap ∩ case sample hits: 0
  base ∩ lid volume mm³: 0.0
  M5 flange bosses: 0
  gold_gap_ok: True

CUSTOMIZER GLB
  /workspace/saap_case/v1f_glue_large/glb/saap_case_large_closed.glb
  /workspace/saap_case/v1f_glue_large/glb/saap_case_large_open_saap.glb